| CPC H03H 9/25 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/64 (2013.01)] | 20 Claims |
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1. A packaged surface acoustic wave device comprising:
first and second conductive vias that extend through a support substrate and a piezoelectric layer;
first and second interdigital transducer electrodes over the piezoelectric layer and positioned between the first and second conductive vias, the first transducer electrode having a first bus bar and a second bus bar with the first bus bar closer to the first conductive via than the second bus bar, the second interdigital transducer electrode having a third bus bar and a fourth bus bar, with the third bus bar closer to second conductive via than the fourth bus bar, the fourth bus bar closer to the second bus bar than the third bus bar;
at least a conductive layer positioned over the piezoelectric layer in an area between the first and second interdigital transducer electrodes, the conductive layer electrically connects the second bus bar with the fourth bus bar;
a roof structure over the first and second interdigital transducer electrodes and the conductive layer; and
at least first, second and third conductive pillars, the first and third conductive pillars are respectively disposed directly over the first and second conductive vias, the first and third conductive pillars supporting the roof structure to form a cavity above the first and second interdigital transducer electrodes and the conductive layer, the second conductive pillar extends through the cavity from the conductive layer to the roof structure to electrically connect the second bus bar and the fourth bus bar with at least a portion of the roof structure.
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