US 12,470,199 B2
Acoustic wave device with vertically mass loaded multi-layer interdigital transducer electrode for transverse mode suppression
Rei Goto, Osaka (JP); and Hironori Fukuhara, Ibaraki (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Dec. 20, 2022, as Appl. No. 18/069,115.
Claims priority of provisional application 63/266,740, filed on Jan. 13, 2022.
Claims priority of provisional application 63/266,737, filed on Jan. 13, 2022.
Prior Publication US 2023/0223917 A1, Jul. 13, 2023
Int. Cl. H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/13 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/02661 (2013.01) [H03H 3/08 (2013.01); H03H 9/02614 (2013.01); H03H 9/131 (2013.01); H03H 9/6489 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a multilayer piezoelectric substrate including a piezoelectric layer and a support substrate below the piezoelectric layer; and
an interdigital transducer electrode including a first layer on the piezoelectric layer, a second layer on the first layer, the second layer being of a less dense material than the first layer, and a plurality of strips in contact with the second layer, each of the plurality of strips extending over an end portion of a respective finger but not extending over a region between fingers of the interdigital transducer electrode and having a density configured to suppress a transverse mode of the acoustic wave device.