US 12,470,197 B2
Acoustic wave device
Tetsuya Kimura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 20, 2023, as Appl. No. 18/211,739.
Application 18/211,739 is a continuation of application No. PCT/JP2021/046580, filed on Dec. 16, 2021.
Claims priority of provisional application 63/129,698, filed on Dec. 23, 2020.
Prior Publication US 2023/0336143 A1, Oct. 19, 2023
Int. Cl. H03H 9/02 (2006.01)
CPC H03H 9/02228 (2013.01) [H03H 9/02015 (2013.01); H03H 9/02102 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a support including a support substrate;
a piezoelectric layer on the support;
an IDT electrode on the piezoelectric layer and including two busbars and a plurality of electrode fingers, the two busbars being a busbar pair and facing each other; and
a dielectric film that is provided on the piezoelectric layer so as to overlap at least a portion of the IDT electrode in plan view; wherein
a ratio d/p is less than or equal to about 0.5, where a thickness of the piezoelectric layer is d and a center-to-center distance between centers of adjacent ones of the electrode fingers is p;
MR≤about 1.75(d/p)+0.075 is satisfied, where a metallization ratio of the plurality of electrode fingers with respect to the intersection region is MR;
a cavity that opens on a side of the piezoelectric layer is provided in the support, and, in plan view, at least a portion of the IDT electrode and the cavity overlap each other;
the IDT electrode includes an intersection region and two gap regions, the intersection region being a region in which the adjacent ones of the electrode fingers overlap each other when viewed in a direction in which the adjacent ones of the electrode fingers face each other, the two gap regions each being positioned between the intersection region and a corresponding one of the two busbars; and
the dielectric film is provided at at least a portion of the two gap regions, and a thermal conductivity of the dielectric film is higher than a thermal conductivity of the piezoelectric layer.