US 12,470,190 B2
Blackened wafers and method for manufacturing the same, and wave filter device having the same
Yilin Liu, Quanzhou (CN); Zhonghe Lin, Quanzhou (CN); Yenfu Lin, Quanzhou (CN); Shihwei Huang, Quanzhou (CN); Minghui Fang, Quanzhou (CN); and Shengyu Yang, Quanzhou (CN)
Assigned to FUJIAN JING'AN OPTOELECTRONICS CO., LTD., Quanzhou (CN)
Filed by FUJIAN JING'AN OPTOELECTRONICS CO., LTD., Quanzhou (CN)
Filed on Jul. 27, 2022, as Appl. No. 17/874,905.
Application 17/874,905 is a continuation in part of application No. PCT/CN2020/118397, filed on Sep. 28, 2020.
Prior Publication US 2022/0368303 A1, Nov. 17, 2022
Int. Cl. H03H 3/08 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01)
CPC H03H 3/08 (2013.01) [H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01); Y10T 29/42 (2015.01)] 16 Claims
OG exemplary drawing
 
1. A method for blackening at least one wafer, comprising the steps of:
(a) performing a reduction treatment on the at least one wafer; and
(b) illuminating the at least one wafer with an ultraviolet (UV) light,
wherein the at least one wafer after the illumination of the UV light has a blackening uniformity value (DE value) smaller than 0.6, and a chromatic value (L value) ranging from 46 to 54.