US 12,470,185 B2
Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same
Alexander Komposch, Morgan Hill, CA (US); Eng Wah Woo, Ipoh (MY); Soon Lee Liew, Ipoh (MY); and Kok Meng Kam, Ipoh (MY)
Assigned to Wolfspeed, Inc., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Jun. 24, 2022, as Appl. No. 17/849,206.
Prior Publication US 2023/0421119 A1, Dec. 28, 2023
Int. Cl. H03F 3/24 (2006.01); H01L 23/36 (2006.01); H01L 23/66 (2006.01); H03F 1/52 (2006.01); H03F 3/195 (2006.01)
CPC H03F 3/245 (2013.01) [H01L 23/36 (2013.01); H01L 23/66 (2013.01); H03F 1/523 (2013.01); H03F 3/195 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01)] 31 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
an interconnect structure comprising a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device; and
a protective structure on the first surface of the interconnect structure, wherein the protective structure exposes a heat dissipating surface, the heat dissipating surface comprises a surface of the at least one die, and the surface of the at least one die is adjacent a surface of the protective structure that is opposite the interconnect structure.