US 12,470,183 B2
Power amplifier modules, systems, and substrates containing field trapper structures
Kevin Kim, Chandler, AZ (US); Vikas Shilimkar, Chandler, AZ (US); and Lakshminarayan Viswanathan, Phoenix, AZ (US)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on Mar. 14, 2022, as Appl. No. 17/694,142.
Prior Publication US 2023/0291369 A1, Sep. 14, 2023
Int. Cl. H01L 23/66 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01)
CPC H03F 3/245 (2013.01) [H01L 23/66 (2013.01); H03F 3/195 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/451 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A power amplifier system, comprising:
a printed circuit board (PCB), comprising:
a PCB frontside on which a module mount region is provided; and
a PCB backside opposite the PCB frontside in a thickness direction;
a power amplifier module (PAM), comprising:
a topside radio frequency (RF) input terminal;
a topside RF output terminal; and
a PAM topside surface on which the topside RF input terminal and the topside RF output terminal are located, the PAM mounted to the PCB in an inverted orientation such that the PAM topside surface is positioned adjacent and faces the module mount region; and
a field trapper structure comprising a first field trapper patch, the first field trapper patch extending parallel to the PCB frontside, composed of an electrically-conductive material, and located within or adjacent the module mount region in the thickness direction, wherein the field trapper structure comprises a field trapper patch array that includes a first field trapper patch and a second field trapper patch distributed along a plane parallel to the module mount region, and wherein the first field trapper patch and the second field trapper patch are electrically isolated from one another within a plane of the PCB frontside;
an electrically-conductive via extending from the first field trapper patch in the thickness direction; and
termination circuitry electrically coupled to the first field trapper patch through the electrically-conductive via, the termination circuitry configured to dissipate electromagnetic energy impinging the first field trapper patch during operation of the power amplifier system.