| CPC H03F 3/193 (2013.01) [H10D 1/66 (2025.01); H03F 2200/451 (2013.01); H03F 2200/72 (2013.01)] | 18 Claims |

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1. A structure comprising:
at least one well in a substrate;
a first metal layer connected to a gate of a transistor circuit;
a second metal layer overlapped over the first metal layer to form a first capacitor;
a third metal layer connected with vias to the first metal layer and overlapped with the second metal layer to form a second capacitor;
a shallow trench isolation (STI) which separates a P+ region from an N+ region and separates the P+ region from the transistor circuit; and
at least one capacitance in at least one of a junction between the at least one well and the substrate and between overlapped metal layers of the first metal layer, the second metal layer, and the third metal layer.
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