US 12,470,174 B2
Radiofrequency amplifier
Renaud Lemoine, Champigny sur Marne (FR); Samia Ouyahia, Vernouillet (FR); Eric Wilhelm, Gisors (FR); and Christophe Boyavalle, Triel sur seine (FR)
Assigned to STMicroelectronics International N.V., Geneva (CH)
Appl. No. 17/800,299
Filed by STMicroelectronics International N.V., Geneva (CH)
PCT Filed Feb. 15, 2021, PCT No. PCT/EP2021/053678
§ 371(c)(1), (2) Date Aug. 17, 2022,
PCT Pub. No. WO2021/165213, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 20157693 (EP), filed on Feb. 17, 2020.
Prior Publication US 2023/0092413 A1, Mar. 23, 2023
Int. Cl. H03F 1/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H04B 1/04 (2006.01)
CPC H03F 1/0211 (2013.01) [H03F 1/565 (2013.01); H03F 3/195 (2013.01); H04B 1/04 (2013.01); H03F 2200/318 (2013.01); H03F 2200/411 (2013.01); H03F 2200/451 (2013.01); H03F 2200/537 (2013.01); H04B 2001/0408 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a radio frequency amplifier, comprising:
a first amplifier stage;
a second amplifier stage; and
an impedance matching circuit comprising a first inductive line and a second inductive line coupled to each other through electromagnetic induction, the first inductive line coupled to an output of the first amplifier stage, and the second inductive line coupled to an input of the second amplifier stage, wherein the first inductive line and the second inductive line are wound around each other and are wound around a decoupling capacitive element coupled to the first inductive line or the second inductive line.