| CPC H02K 3/02 (2013.01) | 20 Claims |

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1. A semiconductive member in which semiconductive resin layers in which metal particles are dispersedly mixed are disposed on a fibrous insulation substrate,
said metal particles having a melting point higher than 200° C. that is a curing temperature of the thermosetting resin and lower than 700° C. that is a softening point of said fibrous insulating substrate, and are made of multiple components containing Pb and Sn, multiple components containing Sn and Sb, multiple components containing Sn and Cu, or multiple components containing Sn and Ag.
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