US 12,470,041 B2
Submount architecture for multimode nodes
Christian Rainer Raabe, Nuremberg (DE); Michael Tittenhofer, Fuerth (DE); and Theodor Kupfer, Feucht (DE)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Jul. 21, 2021, as Appl. No. 17/381,694.
Prior Publication US 2023/0026423 A1, Jan. 26, 2023
Int. Cl. H01S 5/024 (2006.01); G02B 6/42 (2006.01); H01L 23/367 (2006.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01S 5/02469 (2013.01) [G02B 6/4214 (2013.01); G02B 6/4245 (2013.01); G02B 6/428 (2013.01); H01L 23/367 (2013.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a printed circuit board (PCB);
a substrate with a finer structuring than the PCB, wherein a bottom surface of the substrate is coupled to the PCB;
electro-optical components mounted on a top surface of the substrate, the electro-optical components including one or more optical components and one or more electrical components, wherein the one or more optical components are arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate;
an optical transfer assembly coupled to and extending from the substrate, wherein the optical transfer assembly includes one or more lenses to direct the optical signals toward and/or from the one or more optical components;
a first thermal pathway formed in the substrate, wherein the first thermal pathway directs heat dissipated by the one or more optical components in a first direction;
a second thermal pathway that directs heat dissipated by wherein the one or more electrical components in a second direction,
wherein the first direction is opposite from the second direction;
a thermal void positioned in the substrate laterally between the one or more optical components and the one or more electrical components; and
a conductive pathway positioned in the substrate above the thermal void, wherein the conductive pathway operatively connects the one or more optical components to the one or more electrical components.