US 12,470,022 B2
Communication jack having a dielectric film between plug interface contacts
Satish I. Patel, Roselle, IL (US); Roman J. Churnovic, Joliet, IL (US); and Jean de Dieu Muntangana, Chicago, IL (US)
Assigned to Panduit Corp., Tinley Park, IL (US)
Filed by Panduit Corp., Tinley Park, IL (US)
Filed on Nov. 2, 2021, as Appl. No. 17/517,022.
Application 17/517,022 is a continuation of application No. 16/730,281, filed on Dec. 30, 2019, granted, now 11,165,202, issued on Nov. 2, 2021.
Application 16/730,281 is a continuation of application No. 16/032,665, filed on Jul. 11, 2018, granted, now 10,522,947, issued on Dec. 31, 2019.
Application 16/032,665 is a continuation of application No. 15/469,903, filed on Mar. 27, 2017, granted, now 10,050,384, issued on Aug. 14, 2018.
Application 15/469,903 is a continuation of application No. 15/097,553, filed on Apr. 13, 2016, granted, now 9,634,433, issued on Apr. 25, 2017.
Prior Publication US 2022/0059971 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01R 13/646 (2011.01); H01R 13/6461 (2011.01); H01R 13/6464 (2011.01); H01R 13/6466 (2011.01); H01R 13/6469 (2011.01); H01R 24/64 (2011.01)
CPC H01R 13/6464 (2013.01) [H01R 13/6461 (2013.01); H01R 13/6466 (2013.01); H01R 13/6469 (2013.01); H01R 24/64 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A communication jack for mating with a communication plug, said communication jack comprising:
a housing having an aperture for receiving said communication plug;
a plurality of plug interface contacts (PICs) wherein a portion of a first PIC of the plurality of PICs forms a first capacitor plate and a portion of a second PIC of the plurality of PICs forms a second capacitor plate;
a dielectric film separating the first PIC and capacitor plate from the second PIC and capacitor plate; and
a sled positioned at least partially inside said housing, a first end of said sled being proximate said aperture and having a mandrel, a second end being distal said aperture.