US 12,469,955 B2
Antenna packaging structure and manufacturing method thereof
Yaojian Lin, Wuxi (CN); Chen Xu, Wuxi (CN); Shuo Liu, Wuxi (CN); and Chenye He, Wuxi (CN)
Assigned to JCET GROUP CO., LTD., Wuxi (CN)
Appl. No. 18/035,514
Filed by JCET GROUP CO., LTD., Wuxi (CN)
PCT Filed May 19, 2021, PCT No. PCT/CN2021/094565
§ 371(c)(1), (2) Date May 5, 2023,
PCT Pub. No. WO2022/105160, PCT Pub. Date May 27, 2022.
Claims priority of application No. 202011285780.0 (CN), filed on Nov. 17, 2020.
Prior Publication US 2023/0335882 A1, Oct. 19, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 9/0414 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An antenna packaging structure, wherein
the antenna packaging structure comprises a substrate layer, at least one antenna support member, a first antenna layer, a plastic packaging layer and at least one chip;
the substrate layer comprises at least one chip circuit layer, at least one antenna control layer and at least one second antenna layer which are stacked in sequence, and a dielectric loss tangent value of an interlayer dielectric of the second antenna layer is less than 0.01;
the antenna support member is disposed on the second antenna layer, and has a dielectric loss tangent value less than 0.01;
the first antenna layer is disposed on the antenna support member and electrically connected to the second antenna layer through electromagnetic radiation or physical contact;
the chip and the antenna support member are respectively disposed on two opposite surfaces of the substrate layer, and the chip is disposed on the chip circuit layer; and
the plastic packaging layer wraps the substrate layer, the antenna support member, the first antenna layer and the chip.