US 12,469,944 B2
Waveguide package, method of manufacturing the same, and package housing
Jong Min Yook, Seongnam-si (KR); Je In Yu, Seoul (KR); and Dong Su Kim, Seongnam-si (KR)
Assigned to Korea Electronics Technology Institute, Seongnam-si (KR)
Filed by KOREA ELECTRONICS TECHNOLOGY INSTITUTE, Seongnam-si (KR)
Filed on Nov. 7, 2022, as Appl. No. 18/053,222.
Claims priority of application No. 10-2021-0153211 (KR), filed on Nov. 9, 2021.
Prior Publication US 2023/0145380 A1, May 11, 2023
Int. Cl. H01P 3/12 (2006.01); H01L 21/48 (2006.01); H01L 23/043 (2006.01); H01L 23/498 (2006.01); H01P 11/00 (2006.01)
CPC H01P 3/121 (2013.01) [H01L 21/486 (2013.01); H01L 23/043 (2013.01); H01L 23/49827 (2013.01); H01P 11/002 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A waveguide package comprising:
a package structure comprising a waveguide opened toward one side surface of a substrate; and
a semiconductor chip mounted on one surface of the package structure and configured to output an electrical signal to the waveguide,
wherein the waveguide comprises a cavity extending through the one surface of the substrate and another surface of the substrate opposite to the one surface.