| CPC H01M 4/0404 (2013.01) [B41M 5/0047 (2013.01); H01M 4/139 (2013.01)] | 20 Claims |

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1. A method comprising:
coating a conductive substrate with an electrode slurry of solvent, active material, binder, and additives to form a wet electrode; and
injecting a column of miscible non-solvent fluid into a surface of the wet electrode to displace the electrode slurry around the column and initiate non-solvent-induced phase inversion of the binder in contact with the miscible non-solvent fluid such that the binder in contact with the miscible non-solvent fluid solidifies around the column into a solid-free channel at the surface of and into the wet electrode.
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