US 12,469,833 B2
Package structure and manufacturing method thereof
Ching-Wei Liao, Hsinchu County (TW); and Shang-Yu Chang Chien, Hsinchu County (TW)
Assigned to POWERTECH TECHNOLOGY INC., Hsinchu County (TW)
Filed by POWERTECH TECHNOLOGY INC., Hsinchu County (TW)
Filed on Jun. 14, 2023, as Appl. No. 18/209,500.
Claims priority of application No. 111126206 (TW), filed on Jul. 13, 2022.
Prior Publication US 2024/0021595 A1, Jan. 18, 2024
Int. Cl. H01L 25/16 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a first package, comprising:
a first redistribution layer;
at least one chip disposed on the first redistribution layer; and
a second redistribution layer disposed on a side of the chip opposite to the first redistribution layer and electrically connected to the first redistribution layer; and
a second package disposed on the first package, and the second package comprising:
a third redistribution layer electrically connected to the second redistribution layer, wherein the second redistribution layer is disposed between the chip and the third redistribution layer; and
at least three light-emitting elements disposed on the third redistribution layer and electrically connected to the third redistribution layer, wherein each of the light-emitting elements comprises a first surface having a light-emitting region for generating light, the first surface is opposite to the third redistribution layer, and the first surfaces of the light-emitting elements are coplanar.