US 12,469,824 B2
Integrated circuit and radio-frequency module
Yukiya Yamaguchi, Kyoto (JP); Takanori Uejima, Kyoto (JP); Motoji Tsuda, Kyoto (JP); Yuji Takematsu, Kyoto (JP); Shunji Yoshimi, Kyoto (JP); Satoshi Arayashiki, Kyoto (JP); Mitsunori Samata, Kyoto (JP); Satoshi Goto, Kyoto (JP); Yutaka Sasaki, Kyoto (JP); and Masayuki Aoike, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on May 11, 2023, as Appl. No. 18/315,855.
Application 18/315,855 is a continuation of application No. PCT/JP2021/041931, filed on Nov. 15, 2021.
Claims priority of application No. 2020-200130 (JP), filed on Dec. 2, 2020.
Prior Publication US 2023/0282620 A1, Sep. 7, 2023
Int. Cl. H01L 25/065 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An integrated circuit comprising:
a first base including an electric circuit, wherein at least a part of the first base is formed of a first semiconductor material having a first thermal conductivity;
a second base including a power amplifier circuit, wherein at least a part of the second base is formed of a second semiconductor material having a second thermal conductivity lower than the first thermal conductivity; and
a high thermal conductive member disposed between the electric circuit and the power amplifier circuit, wherein at least a part of the high thermal conductive member is formed of a high thermal conductive material having a third thermal conductivity higher than the first thermal conductivity,
wherein at least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view,
wherein the high thermal conductive member is in contact with the first base and the second base,
wherein the high thermal conductive member has a first surface and a second surface, the first surface being in contact with the first base, the second surface being on an opposite side of the first surface and being in contact with the second base,
wherein the second base has
a fourth surface being in contact with the second surface of the high thermal conductive member,
a fifth surface being on an opposite side of the fourth surface, and
a second electrode disposed on the fifth surface, and
wherein at least a part of the second electrode overlaps at least a part of the power amplifier circuit in plan view.