US 12,469,821 B2
Packages with multiple types of underfill and method forming the same
Kuan-Yu Huang, Taipei (TW); Li-Chung Kuo, Taipei (TW); Sung-Hui Huang, Dongshan Township (TW); and Shang-Yun Hou, Jubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 8, 2023, as Appl. No. 18/446,051.
Application 18/446,051 is a division of application No. 17/383,911, filed on Jul. 23, 2021, granted, now 12,087,733.
Claims priority of provisional application 63/188,167, filed on May 13, 2021.
Prior Publication US 2023/0395564 A1, Dec. 7, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/0655 (2013.01) [H01L 23/3185 (2013.01); H01L 23/49833 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 25/18 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/33051 (2013.01); H01L 2224/33152 (2013.01); H01L 2224/3316 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01)] 20 Claims
OG exemplary drawing
 
9. A package comprising:
a first package component;
a second package component over and bonded to the first package component;
a first underfill comprising a part in a first gap between the second package component and the first package component, wherein the first underfill comprises a capillary underfill or a molding underfill;
a third package component over and bonded to the first package component; and
a second underfill in a second gap between the third package component and the first package component, wherein the second underfill comprises a non-conductive film, and wherein the second underfill comprises a base material, and filler particles in the base material, and wherein in a top view of the package, parts of the first underfill are aligned to a ring encircling the second underfill.