US 12,469,818 B2
Method and apparatus for bonding semiconductor substrate
Ying-Jui Huang, Hsinchu County (TW); Ching-Hua Hsieh, Hsinchu (TW); Chien-Ling Hwang, Hsinchu (TW); and Chia-Sheng Huang, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 15, 2023, as Appl. No. 18/183,963.
Application 18/183,963 is a continuation of application No. 16/663,362, filed on Oct. 25, 2019, granted, now 11,631,652.
Claims priority of provisional application 62/792,866, filed on Jan. 15, 2019.
Prior Publication US 2023/0215837 A1, Jul. 6, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H10D 84/01 (2025.01)
CPC H01L 24/83 (2013.01) [H01L 21/187 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/67265 (2013.01); H01L 21/681 (2013.01); H01L 21/682 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H10D 84/01 (2025.01); H01L 2224/7565 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for bonding semiconductor substrates, comprising:
a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other;
a gauging component embedded in the first support and comprising a fiducial pattern;
a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component;
a second support disposed above the first support;
a bond head disposed on the second support and configured to transfer the second semiconductor substrate; and
a second sensor disposed on the second support and above the first support, the second sensor facing towards the second semiconductor substrate to determine a location of an alignment mark on the second semiconductor substrate.
 
10. An apparatus for bonding semiconductor substrates, comprising:
a first support comprising a carrying surface and a rear surface opposite to the carrying surface, wherein a first semiconductor substrate is configured to be bonded to a second semiconductor substrate on the carrying surface;
a gauging component inlaid in the first support, the gauging component comprising a surface on which a fiducial pattern is disposed, wherein the surface of the gauging component is substantially leveled with the rear surface of the first support and the gauging component is a photomask or a wafer; and
a first sensor identifying a position of the first semiconductor substrate on the first support based on the fiducial pattern.
 
17. An apparatus for bonding semiconductor substrates, comprising:
a first support comprising a first side, a second side opposite to the first side, and a recess at the second side, wherein a first semiconductor substrate is disposed on the first side of the first support;
a gauging component disposed in the recess of the first support and comprising a fiducial pattern;
a first sensor facing towards the fiducial pattern of the gauging component;
a second support disposed above the first support;
a second sensor disposed on the second support and facing towards the first support; and
a bond head disposed on the second support and configured to transfer a second semiconductor substrate for bonding the second semiconductor substrate to the first semiconductor substrate, wherein the second sensor faces towards the second semiconductor substrate to determine a location of an alignment mark on the second semiconductor substrate.