US 12,469,816 B2
Semiconductor device
Takeyuki Suzuki, Kaga Ishikawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Kawasaki (JP); and Toshiba Electronic Devices & Storage Corporation, Kawasaki (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed on Sep. 2, 2022, as Appl. No. 17/902,535.
Claims priority of application No. 2022-045800 (JP), filed on Mar. 22, 2022.
Prior Publication US 2023/0317672 A1, Oct. 5, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 24/37 (2013.01) [H01L 23/49562 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/37005 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84359 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first connector including a first plate having a first lower surface and a first upper surface and a first terminal connected to the first plate, the first plate including a second plate and a third plate, a plate thickness of the second plate being thinner than a plate thickness of the third plate, the third plate being provided between the second plate and the first terminal;
a semiconductor chip provided on the first upper surface, the semiconductor chip having a second lower surface facing the first upper surface, a first distance between the first lower surface of the second plate and the second lower surface being shorter than a second distance between the first lower surface of the third plate and the second lower surface;
a first bonding material provided between the first upper surface and the semiconductor chip;
a second connector provided on the semiconductor chip,
a third connector, the first plate being provided between the first terminal and the third connector;
a second bonding material provided between the second connector and the semiconductor chip; and
a third bonding material provided between the second connector and the third connector.