	US 12,469,813 B2
	Heat radiation structure and electronic apparatus
Junki Hashiba, Yokohama (JP); Takuroh Kamimura, Yokohama (JP); Masahiro Kitamura, Yokohama (JP); and Ryota Watanabe, Yokohama (JP)
Assigned to LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed by LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed on Jun. 21, 2023, as Appl. No. 18/338,453.
Claims priority of application No. 2022-120589 (JP), filed on Jul. 28, 2022.
Prior Publication US 2024/0038710 A1, Feb. 1, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01); H01L 25/16 (2023.01)

CPC H01L 24/29 (2013.01) [H01L 23/3733 (2013.01); H01L 24/32 (2013.01); H01L 23/427 (2013.01); H01L 25/16 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29655 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0675 (2013.01); H01L 2924/10158 (2013.01)]

8 Claims

1. A heat radiation structure of an electric component that generates heat, the heat radiation structure comprising:

a heat radiation element along a surface of the electric component;

a porous material between the electric component and the heat radiation element; and

a liquid metal impregnated in the porous material,

wherein, in the porous material, a peripheral portion has a higher material density per unit volume than a central portion.