US 12,469,810 B2
Semiconductor package
Seongyo Kim, Asan-si (KR); Un-Byoung Kang, Hwaseong-Si (KR); Minsoo Kim, Gumi-si (KR); Sang-Sick Park, Hwaseong-si (KR); and Seungyoon Jung, Asan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 7, 2022, as Appl. No. 17/939,127.
Prior Publication US 2023/0230946 A1, Jul. 20, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/09 (2013.01) [H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 24/81 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/08056 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/09132 (2013.01); H01L 2224/09179 (2013.01); H01L 2224/16012 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16059 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17055 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/17132 (2013.01); H01L 2224/17179 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first die having a central region and a peripheral region that surrounds the central region;
through electrodes that penetrate the first die;
first pads at a top surface of the first die and coupled to the through electrodes;
a second die on the first die;
second pads at a bottom surface of the second die, the bottom surface of the second die facing the top surface of the first die;
connection terminals that connect the first pads to the second pads; and
a dielectric layer that fills a space between the first die and the second die and surrounds the connection terminals,
wherein a first width of each of the first pads in the central region is greater than a second width of each of the first pads in the peripheral region,
wherein each of the connection terminals includes a convex portion at a lateral surface thereof, which protrudes beyond a lateral surface of a respective first pad and a lateral surface of a respective second pad, the convex portion protruding in a direction away from a center of the first die, and
wherein protruding distances of the convex portions increase in a direction from the center of the first die toward an outside of the first die.