US 12,469,796 B2
Method of forming an embedded magnetic shielding device
ChangOh Kim, Incheon (KR); JinHee Jung, Incheon (KR); and OMin Kwon, Incheon (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Jun. 30, 2022, as Appl. No. 17/810,028.
Prior Publication US 2024/0006335 A1, Jan. 4, 2024
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising: providing a substrate; disposing a semiconductor die over the substrate; depositing a first encapsulant over the semiconductor die; disposing a ferromagnetic film over the first encapsulant; and depositing a second encapsulant over the ferromagnetic film, wherein vertical side surfaces of the first encapsulant, second encapsulant, and ferromagnetic film are coplanar.