US 12,469,793 B2
Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package
Myeongho Hong, Suwon-si (KR); Dowon Kim, Anyang-si (KR); Jangbae Son, Incheon (KR); Seokwoo Yoon, Cheonan-si (KR); and Kyomuk Lim, Sejong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 18, 2022, as Appl. No. 17/722,689.
Claims priority of application No. 10-2021-0111203 (KR), filed on Aug. 23, 2021.
Prior Publication US 2023/0057039 A1, Feb. 23, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H05K 1/18 (2006.01); H01L 21/66 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/02 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/95 (2013.01); H05K 1/185 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 22/34 (2013.01); H01L 23/5381 (2013.01); H01L 25/0655 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/1815 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure comprising:
a core substrate including a substrate base including a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of second cavities, and a plurality of bridge structures in the plurality of second cavities and extending between each block of the plurality of blocks and the substrate base;
a plurality of semiconductor chips in the plurality of first cavities; and
a molding layer covering the core substrate and the plurality of semiconductor chips, a portion of the molding layer is in the plurality of first cavities and the plurality of second cavities, wherein each bridge structure is in a portion of the second cavity between each block and the substrate base and the molding layer is in a remaining portion of the second cavity between each block and the substrate base.