US 12,469,781 B2
Package structure and manufacturing method thereof
Hsien-Wei Chen, Hsinchu (TW); An-Jhih Su, Taoyuan (TW); and Li-Hsien Huang, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 6, 2024, as Appl. No. 18/434,757.
Application 17/871,998 is a division of application No. 16/923,118, filed on Jul. 8, 2020, granted, now 11,444,021, issued on Sep. 13, 2022.
Application 18/434,757 is a continuation of application No. 17/871,998, filed on Jul. 25, 2022, granted, now 11,929,322.
Application 16/923,118 is a continuation of application No. 16/147,897, filed on Oct. 1, 2018, granted, now 10,741,490, issued on Aug. 11, 2020.
Application 16/147,897 is a continuation of application No. 14/724,817, filed on May 29, 2015, granted, now 10,090,241, issued on Oct. 2, 2018.
Prior Publication US 2024/0178133 A1, May 30, 2024
Int. Cl. H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5226 (2013.01) [H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/311 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 25/0657 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a die, encapsulated by an encapsulant;
a conductive pillar disposed aside the die, wherein the conductive pillar extends through the encapsulant;
a dielectric layer overlying the die and the conductive pillar;
a seed layer disposed between the conductive pillar and the dielectric layer; and
a conductive connector, connected with the conductive pillar and extending through the dielectric layer and the seed layer,
wherein the conductive connector is in contact with the conductive pillar, the seed layer and the dielectric layer, and the seed layer is in contact with the conductive connector and the encapsulant.