US 12,469,774 B2
Electronic package and substrate structure thereof
Yuan-Chang Ni, Taichung (TW); Yu-Cheng Pai, Taichung (TW); Yuan-Ping Yeh, Taichung (TW); Chan-Yu Yeh, Taichung (TW); and Meng-Jou He, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jul. 13, 2023, as Appl. No. 18/351,770.
Claims priority of application No. 112111547 (TW), filed on Mar. 27, 2023.
Prior Publication US 2024/0332149 A1, Oct. 3, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate structure, comprising:
a substrate body having a packaging surface;
a circuit layer formed on the packaging surface, wherein the circuit layer comprises a plurality of conductive traces and a plurality of electrical contact pads bonded to the plurality of conductive traces, and the plurality of conductive traces are separated from each other;
an insulating filling layer formed on the packaging surface and disposed between the plurality of conductive traces, wherein a top surface of the circuit layer is free from being covered by the insulating filling layer; and
an insulating protective layer formed to cover a top surface of a first portion of the insulating filling layer and a first portion of the top surface of the circuit layer, wherein the insulating protective layer has at least one opening exposing the plurality of electrical contact pads and a second portion of the insulating filling layer,
wherein a wall of the at least one opening of the insulating protective layer and a top surface of the second portion of the insulating filling layer form a step-shaped structure,
wherein the insulating filing layer does not overlap with the circuit layer in a plan view above the substrate surface, and
wherein the plurality electrical contact pads include sidewalls exposed by the second portion of the insulating filling layer.