US 12,469,773 B2
Semiconductor device with attached battery and method therefor
Chayathorn Saklang, Bangplee (TH); Namrata Kanth, Mesa, AZ (US); Stephen Ryan Hooper, Queen Creek, AZ (US); and Scott M. Hayes, Chandler, AZ (US)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, INC., Austin, TX (US)
Filed on Nov. 29, 2022, as Appl. No. 18/059,465.
Prior Publication US 2024/0178111 A1, May 30, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49593 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/4952 (2013.01); H01L 23/49555 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, the method comprising:
affixing a semiconductor die to a die pad region of a first battery lead of a leadframe, the first battery lead of the leadframe separated from a second battery lead of the leadframe;
encapsulating with an encapsulant the semiconductor die and portions of the first and second battery leads of the leadframe;
affixing a battery to an exposed portion of the first battery lead of the leadframe, a first terminal of the battery conductively connected to the first battery lead; and
bending an exposed portion of the second battery lead of the leadframe to overlap a top surface portion of the battery, a second terminal of the battery conductively connected to the second battery lead.