US 12,469,763 B2
Package with improved heat dissipation efficiency and method for forming the same
Tung-Liang Shao, Hsinchu (TW); Yu-Sheng Huang, Hemei Township (TW); Kuo Yang Wu, Taoyuan (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 19, 2022, as Appl. No. 17/891,218.
Prior Publication US 2024/0063079 A1, Feb. 22, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/44 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/44 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/16196 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16587 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a semiconductor device;
an encapsulant laterally surrounding the semiconductor device;
a heat dissipation structure disposed over the semiconductor device and the encapsulant, wherein the heat dissipation structure comprises a plurality of pillars and a porous layer extending over sidewalls of the plurality of pillars; and
an oxide bonding film between the heat dissipation structure and the semiconductor device and between the heat dissipation structure and the encapsulant, wherein the oxide bonding film forms a first bonding interface between the heat dissipation structure and the semiconductor device and forms a second bonding interface between the heat dissipation structure and the encapsulant that extends to a periphery of the encapsulant.