US 12,469,761 B2
Power module including highly-heat-dissipating insulation adhesive sheet
Tomohisa Yamane, Tokyo (JP); Kei Yamamoto, Tokyo (JP); Kozo Harada, Tokyo (JP); Masaki Taya, Tokyo (JP); Yo Tanaka, Tokyo (JP); and Kazuhiro Tada, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Mar. 29, 2022, as Appl. No. 17/707,171.
Claims priority of application No. 2021-163244 (JP), filed on Oct. 4, 2021.
Prior Publication US 2023/0105637 A1, Apr. 6, 2023
Int. Cl. H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/3672 (2013.01) [H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A power module comprising:
a heat spreader having a plate shape and having heat conducting property;
a semiconductor element at least thermally connected to a one-side surface of the heat spreader;
a highly-heat-dissipating insulation adhesive sheet having a plate shape and having a one-side surface thermally connected to an other-side surface of the heat spreader;
a metal plate having a one-side surface thermally connected to an other-side surface of the highly-heat-dissipating insulation adhesive sheet; and
a sealing resin member sealing the semiconductor element, the heat spreader, the highly-heat-dissipating insulation adhesive sheet, and the metal plate in a state where an other-side surface of the metal plate is exposed, and
wherein as seen in a direction perpendicular to the one-side surface of the heat spreader, an outer periphery portion of the surface, of the heat spreader, that is in contact with the highly-heat-dissipating insulation adhesive sheet has at least one step which is formed so as to be recessed from the outer periphery portion toward an inner portion of the heat spreader.