US 12,469,757 B2
Package structure including a die having a taper-shaped die connector
Hung-Jui Kuo, Hsinchu (TW); Hui-Jung Tsai, Hsinchu (TW); Tai-Min Chang, Taipei (TW); and Chia-Wei Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 1, 2024, as Appl. No. 18/652,779.
Application 18/652,779 is a continuation of application No. 17/979,713, filed on Nov. 2, 2022, granted, now 11,990,383.
Application 17/979,713 is a continuation of application No. 16/886,755, filed on May 28, 2020, granted, now 11,508,633, issued on Nov. 22, 2022.
Prior Publication US 2024/0282653 A1, Aug. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3114 (2013.01) [H01L 21/561 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a first die comprising:
a substrate;
a plurality of pads over the substrate;
a passivation layer on portions of each of the plurality of pads;
a plurality of first die connectors on the plurality of pads, respectively; and
a dielectric layer laterally encapsulating the plurality of first die connectors;
an encapsulant laterally encapsulating the first die,
wherein one of the plurality of first die connectors is a taper-shaped die connector, and a width of the one of the plurality of first die connectors gradually increases from a top surface of the one of the plurality of first die connectors toward a top surface of the passivation layer.