US 12,469,755 B2
Power module and power conversion device using the same
Nobutake Tsuyuno, Tokyo (JP); Takahiro Araki, Tokyo (JP); Takashi Hirao, Tokyo (JP); and Takeshi Tokuyama, Tokyo (JP)
Assigned to HITACHI, LTD., Tokyo (JP)
Appl. No. 18/009,760
Filed by HITACHI, LTD., Tokyo (JP)
PCT Filed May 21, 2021, PCT No. PCT/JP2021/019407
§ 371(c)(1), (2) Date Dec. 12, 2022,
PCT Pub. No. WO2021/261136, PCT Pub. Date Dec. 30, 2021.
Claims priority of application No. 2020-109102 (JP), filed on Jun. 24, 2020.
Prior Publication US 2023/0283190 A1, Sep. 7, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 25/18 (2023.01); H02M 7/00 (2006.01); H02P 27/06 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 25/18 (2013.01); H02P 27/06 (2013.01); H02M 7/003 (2013.01); H05K 7/20927 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A power module comprising:
a power semiconductor element converting DC power into AC power and outputting the AC power to a motor;
a conductor electrically connected to the power semiconductor element;
a substrate having a substrate wiring connected to the conductor on a surface; and
a resin sealing material sealing the power semiconductor element, the conductor, and the substrate,
wherein the substrate has, at a position in contact with an end portion of the resin sealing material, a concave portion formed by a surface of the substrate wiring becoming concave in a continuously curved surface shape, and
wherein the concave portion is formed around an entire circumference of the resin sealing material.