US 12,469,741 B2
Apparatus for processing substrate
Kyung Taek Im, Chungcheongnam-do (KR); Hwi Jae Lee, Chungcheongnam-do (KR); and Kyoung Don Lee, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on May 6, 2023, as Appl. No. 18/144,172.
Claims priority of application No. 10-2022-0122318 (KR), filed on Sep. 27, 2022.
Prior Publication US 2024/0105498 A1, Mar. 28, 2024
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68785 (2013.01) [H01L 21/67103 (2013.01); H01L 21/68742 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, the apparatus comprising:
a support plate including a first accommodation space having a disk shape disposed therein and supporting a substrate;
a first cooling means accommodated in the first accommodation space and including a phase change material; and
a second cooling means disposed in the support plate and disposed to have at least a portion of the first cooling means interposed between the second cooling means and an upper surface of the support plate, and including cooling liquid flowing in the support plate,
wherein the first cooling means includes a heat transfer member disposed on an internal wall surface of the first accommodation space and in contact with the phase change material, and
wherein the heat transfer member includes a first heat transfer member disposed on an upper wall surface of the first accommodation space and a second heat transfer member disposed on a lower wall surface of the first accommodation space.