US 12,469,739 B2
Methods of operating a spatial deposition tool
Joseph AuBuchon, San Jose, CA (US); Sanjeev Baluja, Campbell, CA (US); Michael Rice, Pleasanton, CA (US); Arkaprava Dan, San Jose, CA (US); and Hanhong Chen, Milpitas, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 25, 2019, as Appl. No. 16/664,406.
Application 16/664,406 is a continuation in part of application No. 16/171,785, filed on Oct. 26, 2018.
Claims priority of provisional application 62/751,909, filed on Oct. 29, 2018.
Claims priority of provisional application 62/578,365, filed on Oct. 27, 2017.
Prior Publication US 2020/0066572 A1, Feb. 27, 2020
Int. Cl. C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01L 21/285 (2006.01)
CPC H01L 21/68764 (2013.01) [C23C 16/45544 (2013.01); C23C 16/45551 (2013.01); C23C 16/4584 (2013.01); C23C 16/4588 (2013.01); H01L 21/02104 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/28506 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method comprising:
providing a processing chamber comprising x number of spatially separated isolated processing stations within the processing chamber, x being an integer in a range of from 4 to 10, the processing chamber having a processing chamber temperature and each processing station independently having a processing station temperature, the processing chamber temperature different from the processing station temperatures;
rotating a substrate support assembly within the processing chamber, the substrate support assembly having a plurality of substrate support surfaces aligned with the x number of spatially separated isolated processing stations rx times so that each substrate support surface rotates (360/x) degrees in a first direction to a location of an adjacent substrate support surface, r being a whole number greater than or equal to 1, each of the plurality of substrate support surfaces respectively comprising a heater and having a sealing platform connected to the heater at a position below and surrounding the heater so that a top surface of the sealing platform is below a top surface of the heater, the sealing platform configured to provide a seal or barrier to minimize gas flowing to a region below the substrate support assembly; and
rotating the substrate support assembly rx times within the processing chamber so that each substrate support surface rotates (360/x) degrees in a second direction to the location of the adjacent substrate support surface.