US 12,469,738 B2
Substrate support, plasma processing apparatus, and ring replacement method
Shin Matsuura, Miyagi (JP); Nobutaka Sasaki, Miyagi (JP); and Gyeong min Park, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Dec. 6, 2022, as Appl. No. 18/075,451.
Claims priority of application No. 2021-198257 (JP), filed on Dec. 7, 2021.
Prior Publication US 2023/0178417 A1, Jun. 8, 2023
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/67069 (2013.01); H01L 21/67751 (2013.01); H01L 21/68735 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate support comprising:
a substrate supporting portion;
a first ring disposed to surround the substrate supporting portion;
a second ring surrounding the first ring without overlapping the first ring in plan view such that an open gap is present between the first ring and the second ring;
a third ring disposed below the first ring and the second ring such that an inner portion of the third ring overlaps the first ring in plan view and an outer portion of the third ring overlaps the second ring in plan view, and having a through hole at the inner portion of the third ring;
a lifter having a first engaging portion protruding upward through the through hole in the third ring and engaged with the first ring and a second engaging portion disposed below the first engaging portion and engaged with the third ring around a bottom edge of the through hole; and
an actuator configured to raise and lower the lifter.