US 12,469,737 B2
Stage apparatus, lithography apparatus and article manufacturing method
Takahiro Sumi, Tokyo (JP); and Shigeo Koya, Tochigi (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Sep. 15, 2022, as Appl. No. 17/945,150.
Claims priority of application No. 2021-158396 (JP), filed on Sep. 28, 2021.
Prior Publication US 2023/0110011 A1, Apr. 13, 2023
Int. Cl. H01L 21/687 (2006.01); G03F 7/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68742 (2013.01) [G03F 7/70725 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A stage apparatus for holding a substrate, comprising:
a substrate holding unit including a holding surface that holds the substrate;
a driving mechanism configured to place the substrate on the holding surface; and
a control unit configured to control, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, driving of the driving mechanism in a height direction,
wherein the warpage of the substrate is reduced before the substrate is placed on the holding surface,
the driving mechanism includes
a holding member provided to protrude from the holding surface via a hole formed in the substrate holding unit and configured to hold the substrate, and
a driving unit configured to relatively drive the substrate holding unit and the holding member in a protruding direction of the holding member,
the control unit controls a velocity at the time of placing the substrate from the holding member on the holding surface by relatively driving the substrate holding unit and the holding member via the driving unit,
the warpage information includes information representing a shape of the warpage of the substrate,
the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is changed in accordance with the shape of the warpage of the substrate,
if the shape of the warpage of the substrate is a downward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is higher than a predetermined velocity, and
if the shape of the warpage of the substrate is an upward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is lower than the predetermined velocity.