US 12,469,733 B2
Wafer to baseplate arc prevention using textured dielectric
Arvinder S. Chadha, San Jose, CA (US); and Kartik Ramaswamy, San Jose, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 14, 2021, as Appl. No. 17/550,932.
Prior Publication US 2023/0187250 A1, Jun. 15, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/68735 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electrostatic chuck for use in a substrate processing chamber, comprising:
a dielectric plate having an electrode disposed therein, the dielectric plate further including a central portion and a peripheral portion, wherein the peripheral portion comprises an outer sidewall having at least one asperity, wherein the at least one asperity is disposed between an upper surface and a lower surface of the dielectric plate and extends beth radially outward from the outer sidewall; and
wherein at least one of:
the at least one asperity comprises a plurality of asperities extending radially outward along imaginary cylindrical surfaces of the outer sidewall, wherein the imaginary cylindrical surfaces are coaxial with and have different radii with respect to a central axis of the dielectric plate; or
the at least one asperity comprises a plurality of asperities arranged periodically; or
the at least one asperity comprises a plurality of asperities having hemispherical shapes, moth eye shapes, rectangular shapes, ellipsoid shapes, or truncated ellipse shapes; or
the at least one asperity comprises a plurality of asperities having a gap disposed between each of the plurality of asperities.