US 12,469,727 B2
Defect detection device and defect detection method
Hiroshi Munakata, Tokyo (JP); and Takuya Adachi, Tokyo (JP)
Assigned to Yamaha Robotics Co., Ltd., Tokyo (JP)
Appl. No. 18/559,797
Filed by Yamaha Robotics Co., Ltd., Tokyo (JP)
PCT Filed May 10, 2021, PCT No. PCT/JP2021/017711
§ 371(c)(1), (2) Date Nov. 9, 2023,
PCT Pub. No. WO2022/239067, PCT Pub. Date Nov. 17, 2022.
Prior Publication US 2024/0282608 A1, Aug. 22, 2024
Int. Cl. H01L 21/67 (2006.01); G01N 21/95 (2006.01); G01N 29/22 (2006.01); G06T 7/00 (2017.01)
CPC H01L 21/67288 (2013.01) [G01N 21/9501 (2013.01); G01N 29/225 (2013.01); G06T 7/0004 (2013.01); G06T 2207/30148 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A defect detection device, detecting a defect of an inspection target in which a bonding article is bonded to a bonded article, the defect detection device comprising:
a standing wave generator, generating a standing wave, and applying the standing wave that is generated to the inspection target to apply a suction force to the bonding article;
an image capturing device, capturing an image of the inspection target; and
a control part, adjusting an operation of the standing wave generator and performing defect detection on the inspection target,
wherein the control part captures, by using the image capturing device, a first image of the inspection target of a first state in which the suction force is applied to the bonding article and a second image of the inspection target of a second state in which the suction force applied to the bonding article is smaller than the first state, and
the first image of the first state and the second image of the second state are compared to perform defect detection on the inspection target.