| CPC H01L 21/67288 (2013.01) [H01L 21/67265 (2013.01); H01L 21/67742 (2013.01); H01L 21/681 (2013.01)] | 20 Claims |
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1. A semiconductor processing device comprising:
in an equipment front end module (EFEM) for carrying a wafer on which a semiconductor process is to be performed into a load-lock chamber, a stage configured to receive a bare wafer placed thereon;
a laser sensor located above the stage in a vertical direction, perpendicular to an upper surface of the bare wafer;
a camera sensor located above the stage in the vertical direction;
a lighting device configured to radiate an imaging region imaged by the camera sensor with light; and
a controller configured to rotate the stage on which the bare wafer is placed, and configured to, while rotating the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare wafer, and detect a first defect of the bare wafer using the original image,
wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the stage on which the bare wafer is placed, and
wherein the controller is configured to detect the first defect while simultaneously measuring the distance between the laser sensor and the bare wafer.
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