US 12,469,723 B2
Substrate processing apparatus and abnormality detection method
Hiroaki Chihaya, Nirasaki (JP); Tetsuya Miyashita, Nirasaki (JP); Einstein Noel Abarra, Fuchu (JP); and Yasuhiko Kojima, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 24, 2022, as Appl. No. 17/652,332.
Claims priority of application No. 2021-036649 (JP), filed on Mar. 8, 2021.
Prior Publication US 2022/0285182 A1, Sep. 8, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 21/6831 (2013.01); H01L 21/67173 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a stage having an electrostatic chuck configured to attract a substrate;
a temperature sensor arranged in the electrostatic chuck and configured to measure a temperature of the stage;
a temperature converter connected to the temperature sensor and configured to convert a signal from the temperature sensor into a temperature signal; and
a controller configured to detect an abnormality caused by attraction of the substrate by the electrostatic chuck when a temperature of the substrate is higher than the temperature of the stage before the attraction, based on an integral value obtained by integrating a difference between a reference temperature value as a reference and a temperature value of the stage during a step of processing the substrate, the reference temperature value and the temperature value of the stage being obtained based on the temperature signal output from the temperature converter, and the temperature value of the stage fluctuating depending on an amount of heat transferred from the substrate to the electrostatic chuck when the substrate is attracted by the electrostatic chuck.