US 12,469,722 B2
Semiconductor manufacturing apparatus
Masaki Ueno, Tokyo (JP); Kinya Yamashita, Tokyo (JP); and Yasushi Takaki, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Jul. 22, 2022, as Appl. No. 17/814,446.
Claims priority of application No. 2021-206231 (JP), filed on Dec. 20, 2021.
Prior Publication US 2023/0197476 A1, Jun. 22, 2023
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67132 (2013.01) [B32B 43/006 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape, wherein
the pickup stage comprises first pushing-up blocks at four corners thereof, and
each of the first pushing-up blocks comprises
a first side configured to be parallel to one side of the square semiconductor chip with the square semiconductor chip placed on the apparatus,
a second side configured to be parallel to another side of the square semiconductor chip with the square semiconductor device placed on the apparatus, and
an offset portion formed between the first side and the second side to be offset to an inward side of an intersection point of respective extension lines of the first side and the second side.