US 12,469,720 B2
Electroplating wetting chamber with reduced bubble entrapment
Kyle M. Hanson, Kalispell, MT (US); Eric J. Bergman, Kalispell, MT (US); Gregory J. Wilson, Kalispell, MT (US); Paul R. McHugh, Kalispell, MT (US); Benjamin Clay Bradley, Kalispell, MT (US); Aaron Paul Juntunen, Kalispell, MT (US); Deepak Saagar Kalaikadal, Kalispell, MT (US); Daniel Durado, Kalispell, MT (US); Carl Campbell Stringer, Whitefish, MT (US); James Jay Tripp, Kalispell, MT (US); Jason A. Rye, Kalispell, MT (US); and John L. Klocke, Kalispell, MT (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 28, 2023, as Appl. No. 18/342,991.
Prior Publication US 2025/0006519 A1, Jan. 2, 2025
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67051 (2013.01) [H01L 21/02068 (2013.01); H01L 21/67376 (2013.01); H01L 21/67389 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of wetting a substrate, the method comprising:
forming an atmosphere in a basin housing the substrate with a gas, wherein the substrate defines a plurality of features and is coupled with a system head, wherein a head seal is releasably coupled with an upper surface of the basin in a processing position, forming a seal between the basin and a head assembly, wherein the basin comprises a bottom surface and one or more sidewalls;
spraying a wetting agent comprising water or an aqueous solution with a spray head onto the substrate while maintaining the atmosphere, wherein the spray head is positioned below the substrate;
rotationally translating the system head and the substrate while maintaining the spraying and the atmosphere; and
wetting the plurality of features defined in the substrate;
wherein a distance between the bottom surface of the basin housing and the spray head is less than a height of the one or more sidewalls and the distance maintains the spray head above a height of the aqueous solution or water during the wetting of the substrate.