US 12,469,682 B1
Electrical discharge machining processing for semiconductor workpiece
Blake Leonardi Darby, Raleigh, NC (US); and Devon Michael Diehl, Durham, NC (US)
Assigned to WOLFSPEED, INC., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on May 13, 2024, as Appl. No. 18/662,033.
Int. Cl. H01J 37/32 (2006.01); B23K 26/34 (2014.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01)
CPC H01J 37/32348 (2013.01) [B23K 26/34 (2013.01); H01L 21/02005 (2013.01); H01L 22/12 (2013.01); H01J 2237/336 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method, comprising:
removing a portion of a semiconductor boule using a removal process to form a wide bandgap semiconductor workpiece; and
exposing the wide bandgap semiconductor workpiece to one or more electrical discharges from an electrical discharge machining (EDM) system after the removal process to remove material from an exposed surface of the wide bandgap semiconductor workpiece.