US 12,469,646 B2
Thin-film chip resistor-capacitor for miniaturization and thinning
Shen-Li Hsiao, Kaohsiung (TW); Kuang-Cheng Lin, Kaohsiung (TW); and Po-Hsun Shih, Changhua County (TW)
Assigned to YAGEO CORPORATION, Kaohsiung (TW)
Filed by YAGEO CORPORATION, Kaohsiung (TW)
Filed on Oct. 7, 2022, as Appl. No. 17/938,678.
Claims priority of application No. 202210848600.8 (CN), filed on Jul. 19, 2022.
Prior Publication US 2024/0029960 A1, Jan. 25, 2024
Int. Cl. H01G 4/33 (2006.01); H01G 4/10 (2006.01); H01G 4/40 (2006.01); H10D 1/47 (2025.01); H10D 1/68 (2025.01)
CPC H01G 4/33 (2013.01) [H01G 4/10 (2013.01); H01G 4/40 (2013.01); H10D 1/47 (2025.01); H10D 1/692 (2025.01)] 11 Claims
OG exemplary drawing
 
1. A thin-film chip resistor-capacitor, comprising:
a substrate;
a resistor layer disposed over the substrate;
a first dielectric layer disposed over the resistor layer;
a first thin-film capacitor layer disposed on the first dielectric layer, the first thin-film capacitor layer having a first capacitor electrode and a second capacitor electrode that are physically separated with respect to each other;
a first terminal electrode disposed on a first side edge of the substrate and coupled to the resistor layer and the first capacitor electrode;
a second terminal electrode disposed on a second side edge of the substrate opposite to the first side edge and coupled to the resistor layer and the second capacitor electrode; and
a second thin-film capacitor layer disposed on another side of the substrate opposite to the resistor layer, the second thin-film capacitor layer comprising a third capacitor electrode and a fourth capacitor electrode that are physically separated and are respectively coupled to the first terminal electrode and the second terminal electrode.