US 12,469,642 B2
Multilayer electronic component
Dae Hee Lee, Suwon-si (KR); Seung Min Kang, Suwon-si (KR); Hong Seok Kim, Suwon-si (KR); and Chang Hak Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 22, 2024, as Appl. No. 18/584,412.
Claims priority of application No. 10-2023-0033554 (KR), filed on Mar. 14, 2023.
Prior Publication US 2024/0312713 A1, Sep. 19, 2024
Int. Cl. H01G 4/224 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including (i) a dielectric layer including Ba and Ti and (ii) an internal electrode alternately disposed with the dielectric layer, the body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces;
a side margin portion disposed on the fifth and sixth surfaces; and
an external electrode disposed on the third and fourth surfaces,
wherein the side margin portion includes Sn and a transition metal, and
wherein, in the side margin portion, a mole ratio of the transition metal to Sn is 10 or more.