US 12,469,639 B2
Method for manufacturing multilayer coil component
Yuya Ishima, Tokyo (JP); Shinichi Kondo, Tokyo (JP); Kosuke Ito, Tokyo (JP); and Shingo Hattori, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Mar. 4, 2022, as Appl. No. 17/686,599.
Claims priority of application No. 2021-037457 (JP), filed on Mar. 9, 2021; and application No. 2021-209055 (JP), filed on Dec. 23, 2021.
Prior Publication US 2022/0293339 A1, Sep. 15, 2022
Int. Cl. G03F 7/00 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01)
CPC H01F 41/043 (2013.01) [G03F 7/0035 (2013.01); H01F 41/12 (2013.01)] 4 Claims
 
1. A method for manufacturing a multilayer coil component including
an element body formed to have a plurality of insulator layers layered therein, and
a coil disposed inside the element body and constituted to include a plurality of conductors and via conductors connecting the corresponding conductors to each other, the method for manufacturing a multilayer coil component comprising:
forming the plurality of insulator layers by a photolithography method using a photosensitive insulator paste;
forming the plurality of conductors and the via conductors by a photolithography method using a photosensitive conductive paste;
a step of forming a first conductor;
a step of forming a first insulator layer provided around the first conductor such that the first insulator layer becomes even with an upper surface of the first conductor;
after the step of forming the first insulator layer, performing a step of forming a second insulator layer with a via hole exposing a part of the first conductor, the via hole extending through the second insulator layer, the second insulator layer being disposed on the first conductor and the first insulator layer; and
a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.