US 12,469,325 B2
Fingerprint sensor with wafer-bonded microlens array
Tsung-Wei Wan, Hsinchu County (TW); Wei-Ping Chen, New Taipei (TW); and Jau-Jan Deng, Taipei (TW)
Assigned to OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed by OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed on Apr. 27, 2022, as Appl. No. 17/730,688.
Prior Publication US 2023/0351798 A1, Nov. 2, 2023
Int. Cl. G06V 40/13 (2022.01); G02B 3/00 (2006.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01)
CPC G06V 40/1318 (2022.01) [G02B 3/0037 (2013.01); H10F 39/024 (2025.01); H10F 39/028 (2025.01); H10F 39/198 (2025.01); H10F 39/805 (2025.01); H10F 39/8057 (2025.01); H10F 39/8063 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A fingerprint sensor comprising:
a plurality of microlens arrays formed on an upper surface of a transparent substrate;
a lower surface of the transparent substrate bonded to an upper surface of an image sensor integrated circuit comprising a plurality of photodiode arrays, each photodiode array comprising a plurality of photodiodes;
a first patterned filter layer on the lower surface of the transparent substrate;
a second unmasked filter on the lower surface of the transparent substrate;
wherein each microlens of the microlens array is aligned with a respective photodiode array of the image sensor integrated circuit.