| CPC G06K 19/0772 (2013.01) | 15 Claims |

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14. A method for releasing an adhesive connection for a card-like data carrier which comprises an electronic chip module with at least one chip and a contact structure, and a card body with an arrangement region for receiving the chip module,
wherein the chip module is arranged in the arrangement region of the card body and is connected to the card body by means of at least one adhesive having an irreversibly modifiable chemical structure,
wherein the method comprises the following steps:
providing the card-like data carrier and
thermolytically releasing the adhesive in a predetermined temperature range and/or chemically releasing the adhesive by releasing binding forces to separate the connection between the chip module and the card body.
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