US 12,468,293 B2
Multicomponent module design and fabrication
Kirk D. Peterson, Jericho, VT (US); Steven Paul Ostrander, Poughkeepsie, NY (US); Stephanie E Allard, St-Hyacinthe (CA); Charles L. Reynolds, Red Hook, NY (US); Sungjun Chun, Austin, TX (US); Daniel M. Dreps, Georgetown, TX (US); Brian W. Quinlan, Poughkeepsie, NY (US); Sylvain Pharand, St-Bruno-de-Montarville (CA); Jon Alfred Casey, Poughkeepsie, NY (US); David Edward Turnbull, Orford (CA); Pascale Gagnon, Brigham (CA); Jean Labonte, Cowansville (CA); Jean-Francois Bachand, Bromont (CA); and Denis Blanchard, St-Alphonse de Granby (CA)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Mar. 23, 2021, as Appl. No. 17/209,574.
Prior Publication US 2022/0308564 A1, Sep. 29, 2022
Int. Cl. G05B 19/418 (2006.01)
CPC G05B 19/41875 (2013.01) [G05B 2219/32228 (2013.01); G05B 2219/37224 (2013.01); G05B 2219/45031 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for multicomponent module assembly, the method comprising:
identifying, by one or more computer processors, a failed site on a laminate comprising a plurality of sites;
adding, a machine discernible mark associated with the failed site to the laminate;
placing a mechanically good element at the failed site on the laminate according to the mark;
placing, an electrically good element at a successful site on the laminate according to the mark;
adding an external package to the laminate, the failed site and the successful site;
adding an indicium to an outer surface of the external package, wherein the indicium provides access to mechanically good element location site data; and
providing, a multicomponent module (MCM) comprising the package, the laminate, the failed site and the electrically good element.