US 12,468,221 B2
Imprint apparatus for forming a pattern of an imprint material on a substrate-side pattern region of a substrate by using a mold, and related device manufacturing methods
Tatsuya Hayashi, Utsunomiya (JP); Yosuke Murakami, Utsunomiya (JP); Noriyasu Hasegawa, Utsunomiya (JP); Hirotoshi Torii, Utsunomiya (JP); and Yusuke Tanaka, Utsunomiya (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jan. 3, 2022, as Appl. No. 17/567,474.
Application 17/567,474 is a division of application No. 16/852,718, filed on Apr. 20, 2020, granted, now 11,249,394.
Application 16/852,718 is a division of application No. 15/423,613, filed on Feb. 3, 2017, granted, now 10,663,858, issued on May 26, 2020.
Application 15/423,613 is a continuation of application No. 13/649,448, filed on Oct. 11, 2012, granted, now 9,594,301, issued on Mar. 14, 2017.
Claims priority of application No. 2011-226637 (JP), filed on Oct. 14, 2011; and application No. 2012-202990 (JP), filed on Sep. 14, 2012.
Prior Publication US 2022/0121112 A1, Apr. 21, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B82Y 10/00 (2011.01); B29C 43/02 (2006.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01)
CPC G03F 7/0002 (2013.01) [B29C 43/021 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An imprint apparatus that forms a pattern to a resin on a pattern region of a substrate by using a mold, the imprint apparatus comprising:
a first mechanism configured to apply a force to the mold thereby to deform a pattern region of the mold;
a second mechanism configured to heat the pattern region of the substrate to generate an uneven temperature distribution within the pattern region of the substrate for deforming the pattern region of the substrate; and
a control unit configured to obtain shape difference information between the pattern region of the mold and the pattern region of the substrate, to control a shape of the pattern region of the mold by using the first mechanism based on the obtained shape difference information and to control operation such that an uneven temperature distribution is formed in the pattern region of the substrate by using the second mechanism based on the obtained shape difference information.