US 12,468,216 B2
Phase shift mask for EUV lithography and manufacturing method for the phase shift mask
Tae Joong Ha, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on May 20, 2024, as Appl. No. 18/669,041.
Application 18/669,041 is a division of application No. 17/529,071, filed on Nov. 17, 2021, granted, now 12,025,912.
Claims priority of application No. 10-2021-0077710 (KR), filed on Jun. 15, 2021.
Prior Publication US 2024/0310717 A1, Sep. 19, 2024
Int. Cl. G03F 1/30 (2012.01)
CPC G03F 1/30 (2013.01) 8 Claims
OG exemplary drawing
 
1. A method of manufacturing a phase shift mask, the method comprising;
forming a reflective layer on a substrate;
forming a lower layer on the reflective layer;
forming an upper layer for phase shift on the lower layer;
patterning first phase shift patterns and a second phase shift pattern from the upper layer and patterning device patterns overlapping with the first phase shift patterns and a frame pattern overlapping with the second phase shift pattern from the lower layer, by sequentially etching the upper layer and the lower layer, the frame pattern including alignment holes exposing portions of the reflective layer; and
selectively removing the second phase shift pattern from the frame pattern.