US 12,468,102 B2
Optical module
Weiwei Liu, Shandong (CN); Qian Shao, Shandong (CN); Liu Yang, Shandong (CN); and Tao Wu, Shandong (CN)
Assigned to Hisense Broadband Multimedia Technologies Co., Ltd., Shandong (CN)
Filed by HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed on Aug. 22, 2022, as Appl. No. 17/893,036.
Application 17/893,036 is a continuation of application No. PCT/CN2021/098265, filed on Jun. 4, 2021.
Claims priority of application No. 202010953872.5 (CN), filed on Sep. 11, 2020; application No. 202010953988.9 (CN), filed on Sep. 11, 2020; and application No. 202021992828.7 (CN), filed on Sep. 11, 2020.
Prior Publication US 2022/0404563 A1, Dec. 22, 2022
Int. Cl. G02B 6/42 (2006.01); H01S 5/02 (2006.01); H01S 5/0233 (2021.01); H01S 5/14 (2006.01)
CPC G02B 6/428 (2013.01) [G02B 6/4204 (2013.01); G02B 6/4244 (2013.01); G02B 6/4269 (2013.01); H01S 5/021 (2013.01); H01S 5/0233 (2021.01); H01S 5/141 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a circuit board;
a light-emitting assembly, which is electrically connected to the circuit board through a flexible circuit board for emitting signal light;
wherein the light-emitting assembly comprises:
a housing, a side wall of which is provided with a notch through which the flexible circuit board is electrically connected to an interior of the housing;
a metallized ceramic provided at the notch of the housing, one end of which is located outside the housing and pins are provided on an outer wall of the metallized ceramic, with the flexible circuit board being electrically connected with the pins; another end of the metallized ceramic is located inside the housing and is provided with a pad electrically connected with the pins;
a semiconductor refrigerator provided on a bottom surface of the housing for temperature adjustment;
a transfer ceramic board arranged on the semiconductor refrigerator, with one end of the transfer ceramic board being electrically connected to the pad;
a silicon optical chip provided on a surface of the semiconductor refrigerator and being electrically connected to the pad, which may perform light modulation to generate a signal light, wherein the silicon optical chip comprises a filter, a light inputting port and a light outputting port, and light inside the silicon optical chip passes through the filter, wherein the light inputting port is arranged at a first angle with respect to a horizontal plane; and
a semiconductor optical amplification chip provided on the surface of the semiconductor refrigerator and farther away from the pad with respect to the silicon optical chip, wherein the semiconductor optical amplification chip is electrically connected to another end of the transfer ceramic board, wherein light of multiple wavelengths emitted by the semiconductor optical amplification chip can propagate into the silicon optical chip through the light inputting port, wherein an emitting end surface of the semiconductor optical amplification chip is also arranged at the first angle with respect to the horizontal plane; and
a converging lens configured for converging light emitted from the light outputting port of the silicon optical chip.